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Zarlink's Circuit Emulation Services-over-Packet Processors Meet New Standards From MPLS/Frame Relay Alliance and MEF

- Processors Seamlessly Transmit TDM Circuits Across Any Packet Network

OTTAWA, CANADA, Nov. 24 /PRNewswire-FirstCall/ -- Zarlink Semiconductor (NYSE/TSX:ZL) today announced that its entire line of Circuit Emulation Services (CES)-over-Packet processors fully complies with the industry's newest recommendations for TDM (time division multiplexing) circuit transmission over MPLS (Multiprotocol Label Switching) and Metro Ethernet networks.

The MPLS & Frame Relay Alliance (MFA) recently released implementation agreement MFA 8.0.0, which addresses the encapsulation formats and setup and teardown of connections for carrying TDM circuits across MPLS networks. The MFA's new agreement simplifies TDM transport over MPLS, allowing network operators to move towards a single, converged network delivering voice, video and data services.

The Metro Ethernet Forum (MEF) also ratified new technical specifications for carrier-class Ethernet. Specification MEF 8 defines the implementation for emulating PDH (Plesiochronous Digital Hierarchy) circuits over Metro Ethernet networks, and outlines requirements for employing CES over Metro Ethernet networks as defined in the earlier MEF 3 technical specification. MEF 8, along with new specifications addressing test procedures and network management for Ethernet services, will guide the rollout of Metro Ethernet as a carrier-class service delivery technology.

Zarlink's three-device ZL(TM)50111 high-density and three-device ZL50120 low-density families of CES-over-Packet processors seamlessly "tunnel" from one to 32 streams of TDM voice, video and data traffic, with associated timing and signaling, across MPLS, Ethernet and IP (Internet Protocol) networks. All six devices are in full production.

Designed to meet specifications

The ZL50111 and ZL50120 families fully address the performance specifications outlined by the MFA and MEF. To achieve precise network timing when delivering constant bit-rate voice traffic over variable bit-rate packet networks, Zarlink's CES-over-Packet devices employ hardware and software processing techniques for highly accurate clock recovery and synchronization.

Voice quality is enhanced by advanced on-chip QoS (Quality of Service) mechanisms, such as weighted fair queuing and strict priority, that minimize the effects of network latency by giving time-sensitive TDM packets priority over data packets in processing queues.

"Zarlink's CES-over-Packet processors were designed with features and performance in anticipation of the industry's performance specifications," said Jeremy Lewis, product line marketing manager, Packet Processing, Zarlink Semiconductor. "With Zarlink's packet processor technology, carriers can cost-effectively build-out packet networks to the enterprise, while supporting legacy services and without sacrificing quality or requiring significant infrastructure upgrades."

About Zarlink Semiconductor

For almost 30 years, Zarlink Semiconductor has delivered semiconductor solutions that drive the capabilities of voice, enterprise, broadband and wireless communications. The Company's success is built on its technology strengths, including voice and data networks, consumer and ultra low-power communications, and high-performance analog. For more information, visit http://www.zarlink.com/ .

  Certain statements in this press release constitute forward-looking
  statements within the meaning of the Private Securities Litigation Reform
  Act of 1995. Such forward-looking statements involve known and unknown
  risks, uncertainties, and other factors which may cause the actual
  results, performance or achievements of the Company to be materially
  different from any future results, performance, or achievements expressed
  or implied by such forward-looking statements. Such risks, uncertainties
  and assumptions include, among others, the risks discussed in documents
  filed by the Company with the Securities and Exchange Commission.
  Investors are encouraged to consider the risks detailed in those filings.

  Zarlink, ZL, and the Zarlink Semiconductor logo are trademarks of Zarlink
  Semiconductor Inc.

CONTACT: Zarlink: Ed Goffin, Media Relations,
(613) 270-7112, edward.goffin@zarlink.com; United States: Natalie Sauve,
High Road Communications, (613) 236-0909, nsauve@highroad.com; Europe:
Simon Krelle, Pinnacle Marketing Communications, 44 1908 2355 22,
simonk@pinnacle-marketing.com

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